Product Specifications
| Prod Model: |
ALB-S-01 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Material Size: |
40" X 40" |
| Material: |
Fiberglass Epoxy |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Flame Retardant Properties: |
V0 |
Product Description
High Quality But Cheappest Printed Circuit Board Manufacturing Process Capability:
Item
Manufacture Capability
Material
FR-1, FR-2, FR-4, CEM-1,CEM-3
Thickness
Min.
0.4µm
Max.
5.0µm
Copper Thickness
Min.
35µm
Max.
240µm
Min. Line Width
0.18mm
Min. Line Spacing
0.2mm
Hole
Min.
0.2mm
Max.
5.0mm
Min. Size of the Slot
0.6mm×1.5mm
Tolerance of Normal Hole
±0.05mm
Tolerance of Hole Location
Min. ±0.08mm
Min. EDGE To Conductor
0.3mm
Min. Clearance To Holes
0.3mm
Min. Annular Ring
Paper Phenolic
Min. 0.4mm
CEM-1/CEM-3
Min. 0.35mm
With NC Drilling Hole
Min. 0.2mm
Solder Resist Thickness
Min. 10µm
Legend&Marking Min. Width
0.2mm
Legend Color
Black, White, Blue, Green
Surface Finish
HASL(Hot Air Solder Leveling)
ENIG(Electroless Nickel/Immersion Gold)
Immersion Silver
OSP(Organic Solderability Preservatives)
Thickness of Peelable Solder resist
Min.
0.2mm
Max.
0.35mm
Thickness of HASL
Min.
1.3µm
Max.
50µm
Min. Size of The Board
120mm×120mm
Out Line Dimension Tolerance of the Board
±0.1mm
V-CUT Panel Size
Min.
50mm
Max.
450mm
High Quality But Cheappest Printed Circuit Board Flow Chart:
Cut Lamination → Drilling → Dry Film Lamination → Exposure → Developing → Pattern Plating → Stripping→ Etching → Solder Mask → Exposure → Developing → Legend → UV Cure → HASL → Profile → E-test → Final Visual Inspection → Packing → Shipping
High Quality But Cheappest Printed Circuit Board Material:
PCB Material FR-1 Paper+Phenolic Resin+Copper Foil
FR-1 Features:
1.In high temperature warpage and twist both less than 1.0%
2.Suitable for punching at 40~70ºC
3.High CTI Value(CTI Over 600V need special request)
FR-1 General Properties:
Test Item
Unit
Test Condition
Testing Method
Specification
Typical Value
Solder Resistance
Sec
A
JIS C 6481
≥10
20~30
Heat Resistance
----
130ºC,30min
JIS C 6481
No Change
No Change
Peel Strength(Copper Foil 35µm)
Kgf/cm
A260ºC/10 Sec
JIS C 6481
≥1.2
1.7~2.01.6~1.9
Flexural Strength
Lengthwise
Kgf/mm2
A
JIS C 6481
≥8
15~17
Crosswise
≥8
14~15
Volume Resistivity
Ω.-cm
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
5X1095X108
1.0X1012 ~ 10131.0X1012 ~ 1013
Surface Resistivity
Adhesive Side
Ω
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
1X10101X109
1.0X1011 ~ 10121.0X1010 ~ 1011
Laminate Side
C-96/20/65C-96/20/65+C-96/40/90
1X1091X107
1.0X1010 ~ 10111.0X109 ~ 1010
Insulation Resistance
Ω
C-96/20/65C-96/20/65+D-2/100
JIS C 6481
1X1091X106
1.0X1011 ~ 10121.0X108 ~ 109
Chemical Resistance
---
3% NaOH 40ºC 3min
JIS C 6481
No Change
No Change
Boiled in trichloroethylene for 3 min
JIS C 6481
No Change
No Change
Moisture Absorption
%
E-24/50+D-24/23
JIS C 6481
≤2
0.8~1.0
Flammability
Rating
A
UL94
UL94 V-0
V-0
Dielectric Constant(1 MHz)
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤5.5≤6.0
4.0~5.04.5~5.5
Dissipation Factor
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤0.05≤0.1
0.025~0.0350.045~0.055
CTI Value
V
0.1% NH 4CL
IEC 112
≥175
≥175
Punching Temperature
ºC
A
GB/T4722
40-70
40-70
Remarks: Typical values for reference only . Stand values according to JIS-C-6485
A = Keep the specimen originally without any process;
C = Temperature and humidity conditioning;
D = Immersing in distilled water with temperature control;
E = Temperature conditioning.
PCB Material FR-2 Paper+Phenolic Resin+Copper Foil
FR-2 Features:
1.Low cost but with wide range of application
2.Superior heat and humidity resistance
3.Suitable for punching at 40~70ºC
4.Warpage and twist are small and stable
5.Excellent dimensional stability
FR-2 General Properties:
Test Item
Unit
Test Condition
Testing Method
Specification
Typical Value
Solder Resistance
Sec
A
JIS C 6481
≥10
20~30
Heat Resistance
---
130ºC 30min
JIS C 6481
No Change
No Change
Peel Strength(Copper Foil 35µm)
Kgf/cm
A250ºC/10Sec
JIS C 6481
≥12
1.8~2.01.7~1.9
Flexural Strength
Lengthwise
Kgf/mm2
A
JIS C 6481
≥8
14~16
Crosswise
≥8
13~14
Volume Resistivity
Ω-cm
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
5X10105X109
1.0X1012~10131.0X1012~1013
Surface Resistivity
Adhesive Side
Ω
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
1X10121X1011
1.0X1012~10131.0X1011~1012
Laminate Side
C-96/20/65C-96/20/65+C-96/40/90
1X10115X108
1.0X1011~10121.0X1010~1011
Insulation Resistance
Ω
C-96/20/65C-96/20/65+D-2/100
JIS C 6481
1X10111X108
1.0X1011~10121.0X109~1010
Chemical Resistance
---
3% NaOH 40ºC 3min
JIS C 6481
No Change
No Change
Boiled in trichloroethylene for 3 min
JIS C 6481
No Change
No Change
Moisure Absorption
%
E-24/50+D-24/23
JIS C 6481
≤0.75
0.5~0.7
Flammability
Rating
A
UL94
UL94 V-0
V-0
Dielectric Constant(1 MHz)
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤5.0≤5.3
4.0~5.04.5~5.5
Dissipation Factor
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤0.04≤0.05
0.025~0.0350.035~0.045
CTI Value
V
0.1% NH4CL
IEC 112
≥175
≥200
Punching Temperature
ºC
A
GB/T4722
40~70
40~70
Remarks: Typical values for reference only . Stand values according to JIS-C-6485
A = Keep the specimen originally without any process;
C = Temperature and humidity conditioning;
D = Immersing in distilled water with temperature control;
E = Temperature conditioning.
PCB Material CEM-1 Paper+ Fiberglass Fabric +Eoxy Resin+Copper Foil
CEM-1 Features:
Excellent punching property,Suitable for punching at 45ºC~70ºC
Good thermal reliability and moisture resistance,lower warpage
Good mechanical properties and electrical properties.
CEM-1 General Properties:
Test Item
Unit
Test Method(IPC-TM-650)
Test Condition
Specification(IPC-4101C)
Typical Value
Peel Strength(1 oz.)
N/mm
2.4.8
125ºC
---
1.65
Float 260ºC/10Sec
≥1.05
1.6/1.45
Thermal Stress
Sec
2.4.13.1
Float 260ºC/unetched
≥10
25
Bow/Twist
%
2.4.22.1
A
≤1.5
0.3/0.4
Flexural Strength
N/mm2
2.4.4
Warp
≥242
420
Fill
≥172
290
Flammability
Rating
UL94
UL-94
UL94 V-0
V-0
Surface Resistivity
MΩ
2.5.17.1
C-96/35/90
≥1.0X104
1.0X107
Volume Resistivity
MΩ-cm
2.5.17.1
C-96/35/90
≥1.0X106
1.0X108
Z-Axis Expansion
Ppm/ºC
2.4.24
E-2/105 TMA
---
100/320
%
---
6.0
Dielectric Constant
---
2.5.5.2
Etched/@1 MHz
≤5.4
4.6
Loss Tangent
---
2.5.5.2
Etched/@1 MHz
≤0.035
0.023
Arc Resistance
Sec
2.5.1
D-48/50+D-0.5/23
≥60
125
Moisture Absorption
%
2.6.2.1
D-24/23
≤0.5
0.15
Comparative Tracking Index
V
IEC60112
Etched/0.1%NH4CL
≥175
175/300/600
Remarks: Typical values for reference only. Specimen Thickness:1.6mm 1/0
A = Keep the specimen originally without any process;
C = Temperature and humidity conditioning;
D = Immersing in distilled water with temperature control;
E =Temperature conditioning
High Quality But Cheappest Printed Circuit Board Applications:
Home Electrical Appliance, Display, Power Supply, Keyboard, Instrument, Game Machine, Ultrasonic Machine
After years of hard work, ALB Technology has become one of biggest manufacturer of high performance single side PCB, double and multilayer PCB, HDI, FPC. SMT, weld, assembley and design manufacturer trusted by the international and domestic clients. Our PCB products are widely applied to telecommunication, industrial control, computer, spaceflight, aircraft and weapons and other areas.
Our company contorls the quality process management based on ISO9001 quality control system, and certified by ISO14001 environmental management system, OHSAS18001 occupational health and safety management system, our products have been passed the United States UL certifiaction. The company also promotes ISO/TS16949 quality management system, QC080000 hazardous materials management system, and always supports quality, production, human resources and other effective management etc. Through the continuous efforts from all the staff, our internation sales has had a great developments all over the country and also covers markets like Southeast Asia, North America, Russia, and Korea, etc.
