High Quality PCB Board and Circuit Board

Product Specifications

Prod Model:	pcb, pcbs, pcb board, circuit board
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Surface Finish:	Enig, Immersion Silver, HASL, OSP, Gold Finger
Special Process:	Epoxy Resin, Laser Drill, Blind/Bury Holes
Board Thickness:	0.2~3.2mm
Type:	Rigid Circuit Board
Dielectric:	FR-4
Material:	Fiberglass Epoxy
Flame Retardant Properties:	V0

Product Description

High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001:2004

Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

Payment method
1. T/T
2. Paypal
3. Western Union

Files	Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No.	1 - 16 Layers
Board thickness	0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.3OZ - 6OZ
Impedance Control	±10%
Warp and Twist	≤0.075%
Peel Strength	≥61B/in(≥107g/mm)
Min Trace Width (a)	3mil
Min Space Width (b)	3mil
Min Annular Ring	0.004"(0.1mm)
SMD Pitch (a)	0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027"(0.675mm)
Register tolerance	0.05mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Solder mask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Max PTH Aspect Ratio	10:1
Hole Registration	0.003"(0.075mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au:1-3u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS  ISO9001 TS16949  SGS  UL
Special requirements	Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger