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Supplier: | Xiamen Bolion Circuit Co., Ltd. |
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Price: | Negotiable/Piece |
Min Order: | 1piece |
Quantity:: | |
Trade Terms: | FOB,CFR,CIF |
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Prod Model: | S7475 |
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Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Dimensions: | 179.00 * 23.00mm |
Thickness: | 0.12mm |
Single-layer FPCs with FR4 Stiffener
Model: S7475
Type: Single-sided FPCB
With FR4 stiffener
Material: 1oz CU (RA)/20um ADH/25un PI
Cover layer: 25um PI/25um ADH
Stiffener: PI, 0.8mm FR4
Thickness: 0.12mm
Surface treatment: plating tin 2 to 8um
Dimensions: 179 x 23mm
Width/space: 0.5/0.37mm
Process capability:
Base film thickness:
Polyamide: 12.5/25/35/50um
Polyester: 12.5/25/35/50um
Copper thickness: 12/17.5/35/50/70/105um
Minimum line width/line space: 0.075/0.075mm
Minimum hole size: 0.2mm
Tolerance: outline ±0.05/cover layer ±0.2mm
Peel strength:
Polyamide: above 1.0kgf/cm
Polyester: above 0.8kgf/cm
Solder resistance:
Polyamide: 260°C/10 seconds
polyester: 204°C/5 seconds
Certificates: UL, TS16949
Meets RoSH and WEEE lead-free requirement
Advantage:
1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Main Technique Index | ||
Description | Parameters | |
Polyimide | Polyester | |
Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
Copper Thickness (um) | 12,17.5,35,50,70,105 | |
Min. Line Width/Line Space (mm) | 0.075/0.075 | |
Min. Hole Size (mm) | 0.15 | |
Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
Solder Resistance | 260C 10 seconds | 204C 5 seconds |
Surface Treatment | ||
Content | Normal coating thickness | Normal PNL size |
Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
OSP (In house) | N/A | 300mm×400 MM |
ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |
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