Ceramic to metal sealed HHL packages are widely used to package high power laser diode. Typycally, these package are isolated under glass to metal technology, which are not reliable for HiRel applications. With our proven HiRel ceramic-to-metal technology, the isolation is much improved, Ceramic to metal sealed HHL packages has the following features:
1. Pins are isolated with ceramic eyelet, instead of glass eyelet; In order to cater to higher power, pins can be designed to "Copper Cored Kovar" or "ZrCu". ZrCu is capable of loading up higher current.
2. Ceramic to metal sealed HHL packages have high reliability as below:
2.1. Can be used up to high Temperature up to 450 Degree C.
2.2. Military-level qualified reliability.
A: Temp Cycle: -65° C-+175° C 500 Times.
B: Thermal Shock: -65~150° C 15times
3. Glass seal is easily to be cracked and cause hermeticity and reliability issue. Ceramic eyelet can pass all stingent tests. Pins can be bend at 90 degree without cracking, easy to use.
SStreamtek Electronics was found in 1998 and started the operation in China since 1999, our mission is to be a global supplier and a solution provider of hermetic packages and assemblies with expected high quality at competitive price; Streamtek has two business unit: Glass to metal Seal and Ceramic to metal Seal; And offers wide variety of high reliability hermetic packages that are used in applications of: Military, Aerospace, Aviation, Power electronics, Bio-Medical, Automotive, Telecommunications, MEMS Sensor, Hybrid IC Indutries.
1. Full solution of hermetic packages for Power devices that widely used in Aerospace, Aviation, Power Electronics industries. These packages are manufactured per China Military Standard GJB923A-2004 (MIL-STD-19500) and screened per: MIL-STD-38354. All these packages are sealed with Ceramic eyelet for excellent performance and high reliability, we have full production lines for:
1.1. SMD Package, Such as SMD-0.5, SMD-1, SMD-2, etc
1.2. Ceramic-eyelet To Package: To254, TO257, TO258, TO259, Z shape base is always available; With BeO, Moly, GLIDCOP, W/Cu.
1.3. Ceramic eyelet Hybrid hermetic Package
1.4. Ceramic eyelet Thick film Hybrid hermetic Package
1.5. Ceramic eyelet TO Header
1.6. Ceramic Seal Hermetic Stud Package
1.7. Ceramic-seal Hockey Puk Hermetic Package.
2. Photonics Packages
2.1 Butterfly package with Ceramic Eyelet, HTCC Multiple-layer Ceramic Feedthru, Glass Eyelet, with GPO or Window-lens
2.2. HHL Package with Ceramic Eyelet, Glass Eyelet
2.3. DIL/DIP package with Ceramic Eyelet, Glass Eyelet
2.4. Compact Power package with Ceramic eyelet package
2.5. To header with Ceramic Eyelet, Glass Eyelet
2.6. Package integrate with GPO/Window-lens
2.7. Packages for Modulators
4. Glass to metal Seal Sensor Header
1. Stainless Steel Sensor Header, 13mm, 19mm
2. To5 Header, To8 Header
5. Glass to metal Seal Hybrid IC Package
1. DIL/DIP package
2. Flat-packages
3. Platform packages
