Product Specifications
| Prod Model: |
400 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Type: |
Automatic Screen Printing Machine |
| Style: |
Screen-process Printing Press |
| Structure: |
Flat-bed cylinder press |
| System Supported: |
Windowsxp64 |
| Color & Page: |
Solder Paste |
| Print Interface: |
Ipc |
Product Description
1. Product Functions:
high precision automatic solder paste stencil printer designed for high precision screen printing or stencil printing in SMT industry.
2. Product Features:
A)Support spectrums of PCB sizes from 50mm x 50mm to 400mm x 340mm and PCB thickness from 0.6mm to 6mm.
B)High printing accuracy
1. High positioning accuracy, repeated positioning accuracy ± 0.01mm; Printing accuracy ± 0.025mm.
2. Support glue printing
C)Automatic control improves production efficiency, quality control and cost saving:
1. Automatic stencil positioning
2. Automatic PCB calibration
3. Programmable squeegee pressure
4. Automatic printing
5. Automatic stencil cleaning (dry-type, wet-type and vacuum-type)
D)Adopt company independently developed suspended print head and Programmable pressure adjustment system. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.
E)Programmable motor controls separation speed and distance among the squeegee, stencil and substrates, to realize multi-method separation.
F)Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning.
G)Upward and downward visual positioning.
H)Built-in image processing system
I)Support 2D, SPC functions
3. Applicable pitches of Components
A)SMT Components such as resistors, capacitors, inductors, diode and triode: 01005, 0201, 0402, 0603, 0805, 1206 and other specifications.
B)IC: Support SOP, TSOP, TSSOP, QFN packaging, min. Pitch 0.3 mm; Support BGA, CSP packaging, min. Ball diameter of 0.2 mm;
C)Printing size: 50mm x 50mm ~400 mm x 340 mm
D)PCB Thickness: 0.6mm ~ 6mm
E)FPC Thickness: Thickness less than 0.6 mm (excluding jig)
4. Applicable PCB Types
Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products
Shenzhen Huancheng Automation Equipment Co., Ltd built in 2011, a High-speed developing manufacturer of High Precision Automatic Solder Paste Printer, Which specializes in High Precision Automatic Solder Paste Printer research and development.
Developing with equal pitches, high precision and high density electronic packaging technology such as QFP\SPO\BGA\01005 etc, the HC people are committed to build a high speed, high efficiency, cost-effective "HC highway " in SMT solder paste printing field to make the manufacturing more productive, more cost-effective and more profitable in current fierce competition market of SMT industry.
"stable technical level, innovative design concept, precise manufacturing process, reasonable price, and customer first after-sales system", For this purpose, We have successfully developed CC\CP\CM and other diversified High Precision solder paste printer products to meet the need of different customers.
