Fully Automatice Solder Paste Screen Printer

a high precision automatic solder paste printer designed for high precision screen printing or stencil printing in LED manufacturing industry.

Product Features:
A) Support wide spectrums of PCB size from 100mm x 50mm to 1500mm x 350mm and PCB thickness from 0.6mm to 6mm.
B) High printing resolution:
1. High positioning accuracy, repeat positioning accuracy ± 0.015mm; Printing accuracy 0.03mm.

Support glue printing
C) Automatic control improves production efficiency, controls quality and saves production cost:
1. Automatic stencil positioning;
2. Automatic PCB location calibration
3. Automatic adjustment of squeegee pressure;
4. Automatic printing;
5. Automatic stencil cleaning (dry-type, wet-type);
D) Adopt company independently developed suspended print head with automatic pressure adjustment system. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect paste forming effect.
E) Programmable motor controls separation speed and distance among squeegee, stencil and substrate, to realize multi-method separation.
F) Multi-functional PCB fixed positioning system, for convenient and accurate PCB positioning.
G) Upward and downward visual positioning.
H) Built-in image processing system;
I) Support 2D, SPC functions.

Applicable pitches of Components
A) SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications.
B) IC: Support SOP, TSOP, TSSOP, QFN packaging, min. Pitch 0.3 mm; Support BGA, CSP packaging, min. Ball 0.2 mm.
C) Printing size: 100mm x 50mm ~1500 mm x 350 mm;
D) PCB thickness: 0.6 mm ~ 6 mm
E) FPC thickness: Less than 0.6 mm (excluding jig)

Applicable PCB Types
Applicable to PCB types of LED, mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, space flight and aviation, as well as production and processing of general electronics products

Items			Parameters
Repeat Position Accuracy			±0.01mm
Printing Accuracy			±0.025mm
Printing Speed/Cycle Time			<15s (Exclude Printing & Cleaning)
Products Changeover			<5Min
Screen Stencil Size/Min			1300mmX370(Standard);900mm X 370mm(Optional, pressing plate on guide rail shall be replaced)
Screen Stencil Size/Max			1800mm X 750mm
Screen Stencil Thickness			20mm ~ 40mm
PCB Size/Min			100X50mm
PCB Size/Max			1500X350mm
PCB Thickness			0.6~6mm (thickness <0.8mm need jig )
PCB Warpage Ratio			<1%(Based on diagonal length)
Bottom of Board Size			15mm (distance from pins to PCB)
Edge of Board Size			3mm (distance before PCB clamping)
Transport High			900±40mm
Transport Direction			Left-Right; Right-Left; Left-Left; Right-Right
Transport Speed			50-1200mm/sec programmable control
Board Location	Support System		Magnetic pin/Side support block/Flexible automatic pin(optional)
	Clamping System		Elastic side clamping/Vacuum nozzle/Extension-type Z-direction tabletting
Print head			Programmable motor driven print head (pneumatic control print head: optional)
Squeegee Speed			10~200mm/sec
Squeegee Pressure			0-15kg programmable control
Squeegee Angle			60°(Standard )/55°/45°
Squeegee Type			Steel squeegee (standard), rubber squeegee, and other types of squeegee customizable.
Stencil Separation Speed			0.1~20mm/sec Programmable
Cleaning Method			Dry-type, wet-type
Table Adjustment Range			X:8mm;Y:±10mm;θ:±2°
Type of Fiducial Mark			Standard geometry shape of fiducial point, bonding pad / stencil hole
Camera System			Single digital camera with upward/downward vision system
Air Pressure			4~6Kg/cm2
Air Consumption			Approx 0.07m3 /min
Control Method			PC Control
Power Supply			AC:220±10%,50/60HZ 1Φ 2.5KW
Machine Dimensions			2600(W) x 1220(D) X1550(H)mm (excluding the height of indicating lighthouse)
Weight			Approx. 1800Kg
Operation Temperature			-20°C ~ +45°C
Operation Humidity			30%~60%